ESD PETG Filament
Price range: 249.00 PLN through 489.00 PLN gross
Filament available in the new spool system. Compatible with BambuLab AMS.
Fiberlogy PET-G ESD is a filament designed to protect electronic components sensitive to electrostatic discharge. Thanks to its dissipative and antistatic properties, it effectively minimizes the risk of damage to electronics. Ideal for printing integrated circuit housings, sensors, and measuring instruments.
Filament available in the new spool system. Compatible with BambuLab AMS.
Fiberlogy PET-G ESD is a specialized 3D printing filament designed for the electronics and industrial sectors. The material was developed to effectively protect sensitive components from the destructive effects of electrostatic discharge (ESD). Thanks to its dissipative and antistatic properties, energy is safely dissipated from the surface of the printed part, significantly reducing the risk of damage to electronics.
Electrostatic discharges can lead to serious equipment failures, costly repairs, and component replacements. By using PET-G ESD filament, companies and engineers can eliminate the risk of ESD as early as the design and prototyping stages.
- high ability to dissipate and conduct electrostatic charges,
- excellent mechanical and chemical resistance typical of PET-G,
- low shrinkage and ease of printing,
- precise and stable prints without the need for an enclosed chamber.
Fiberlogy PET-G ESD is a filament designed for creating components for the electronics and measurement industries. It is ideal for printing:
- integrated circuit housings and PCBs,
- covers and housings for sensors and connectors,
- measuring instruments and service components,
- parts requiring protection against electrostatic discharge.
High resistance to electrostatic discharge
Mechanically strong and chemical-resistant
Easy to print—does not require a heated chamber
Low moisture absorption
Printing Parameters
- Printing temperature: 250–265°C
- Bed temperature: 85°C
- Bed material: Smooth PEI + adhesive; Textured PEI; Glass + adhesive
- Curing conditions: 60°C / 4 hours
- Enclosed chamber: recommended
- Airflow: 0–25%
Technical Specifications
- Density: 1.3 g/cm³
- Volume resistivity: 10⁵ – 10⁷ Ω·cm (IEC 60093)
- Surface resistivity: 10⁵ – 10⁸ Ω (ASTM D257 1991)
- Heat deflection temperature under load @ 0.45 MPa: 75°C (ISO 75)
- Glass transition temperature: 85°C (DSC)
- Tensile strength at break: 50 MPa (ISO 527)
- Tensile modulus: 2400 MPa (ISO 527)
- Izod impact strength (notched) @ 23°C: 3 kJ/m² (ISO 180)
- Elongation at break: 5% (ISO 527)
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