ESD ABS Filament – S2
249.00 PLN gross
Fiberlogy ABS ESD is a filament designed to protect electronic components that are sensitive to electrostatic discharge. Thanks to its dissipative and antistatic properties, it effectively minimizes the risk of damage to electronics. It is ideal for printing integrated circuit housings, sensors, and measuring instruments.
Fiberlogy ABS ESD is a specialized filament designed to protect sensitive electronic components from electrostatic discharge (ESD). Thanks to its antistatic and dissipative properties, the material effectively dissipates electrical charges, significantly reducing the risk of damage to electronics and uncontrolled equipment downtime.
Electrostatic discharges can lead to serious malfunctions, costly repairs, and component replacements. Using ABS ESD allows engineers and manufacturers to mitigate ESD risks as early as the prototyping and production stages of functional components.
Properties:
- high resistance to electrostatic discharge and chemicals,
- high impact strength,
- resistance to high temperatures and scratches,
- suitable for mechanical and chemical processing.
Fiberlogy ABS ESD is the ideal material for creating professional components used in the electronics, measurement, and industrial sectors. It is perfect for the production of:
- enclosures and covers for integrated circuits and PCBs,
- protective components for sensors, modules, and electronic connectors,
- enclosures for measurement and test equipment,
- components requiring permanent protection against electrostatic discharge.
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High resistance to electrostatic discharge
Antistatic properties are effective in handles and electronic enclosures.
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High impact strength
The material absorbs impact energy without cracking or shattering.
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Resistance to high temperatures and scratches
It maintains dimensional stability at elevated temperatures and does not undergo thermal deformation.
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Capability for mechanical and chemical processing
The print can be machined, as well as glued, painted, or smoothed with solvent vapor.
Printing Parameters
- Printing temperature: 250–265°C
- Bed temperature: 90–110°C
- Bed material: Smooth PEI + adhesive; Textured PEI; Glass + adhesive
- Curing conditions: 60°C / 4 hours
- Enclosed chamber: recommended
- Airflow: 0–10%
Technical Specifications
- Density: 1.05 g/cm³
- Volume resistivity: 4.1×10⁷ Ω·cm (IEC 60093)
- Surface resistivity: 3.8×10⁷ – 8.1×10⁷ Ω (ASTM D257 1991)
- Tensile strength at break: 55 MPa (ISO 527)
- Tensile modulus: 2100 MPa (ISO 527)
- Izod impact strength (notched) @ 23°C: 5 kJ/m² (ISO 180)
- Elongation at break: 5% (ISO 527)
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Black
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